مؤتمر
Bondable Copper Substrates with Silver Solid Solution Coatings for High-Power Electronic Applications
| العنوان: | Bondable Copper Substrates with Silver Solid Solution Coatings for High-Power Electronic Applications |
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| المؤلفون: | Huo, Yongjun, Lee, Chin C. |
| المصدر: | 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th. :166-172 May, 2017 |
| Relation: | 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781509063154 |
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| تدمد: | 23775726 |
| DOI: | 10.1109/ECTC.2017.188 |