التفاصيل البيبلوغرافية
العنوان: |
Process and Reliability of Large Fan-Out Wafer Level Package Based Package-on-Package |
المؤلفون: |
Rao, V.S., Chong, C.T., Ho, D., Zhi, D.M., Choong, C.S., P.S., S.L., Ismael, D., Liang, Y.Y. |
المصدر: |
2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th. :615-622 May, 2017 |
Relation: |
2017 IEEE 67th Electronic Components and Technology Conference (ECTC) |
قاعدة البيانات: |
IEEE Xplore Digital Library |