مؤتمر
Process and Reliability of Large Fan-Out Wafer Level Package Based Package-on-Package
| العنوان: | Process and Reliability of Large Fan-Out Wafer Level Package Based Package-on-Package |
|---|---|
| المؤلفون: | Rao, V.S., Chong, C.T., Ho, D., Zhi, D.M., Choong, C.S., P.S., S.L., Ismael, D., Liang, Y.Y. |
| المصدر: | 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th. :615-622 May, 2017 |
| Relation: | 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
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