مؤتمر
Effects of Current Stress for Low Temperature Cu/Sn/Cu Solid-State-Diffusion Bonding
| العنوان: | Effects of Current Stress for Low Temperature Cu/Sn/Cu Solid-State-Diffusion Bonding |
|---|---|
| المؤلفون: | Cai, Jian, Wang, Junqiang, Wang, Qian, Wu, Zijian, Wang, Dejun |
| المصدر: | 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th. :1742-1747 May, 2017 |
| Relation: | 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781509063154 |
|---|---|
| تدمد: | 23775726 |
| DOI: | 10.1109/ECTC.2017.96 |