دورية أكاديمية
BGA Interconnection Reliability in Mirrored Module Configurations
| العنوان: | BGA Interconnection Reliability in Mirrored Module Configurations |
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| المؤلفون: | Hagberg, J., Putaala, J., Raumanni, J., Salmela, O., Galkin, T. |
| المصدر: | IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 7(10):1634-1643 Oct, 2017 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 21563950 21563985 |
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| DOI: | 10.1109/TCPMT.2017.2739204 |