مؤتمر
Tensile strength and interfacial reaction of Cu-cored SAC305 solder joint
| العنوان: | Tensile strength and interfacial reaction of Cu-cored SAC305 solder joint |
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| المؤلفون: | Li, D., Yin, L.M., Yao, Z.X., Wang, G., Zhang, L.P., Wang, C.X. |
| المصدر: | 2017 18th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2017 18th International Conference on. :513-515 Aug, 2017 |
| Relation: | 2017 18th International Conference on Electronic Packaging Technology (ICEPT) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781538629727 9781538629710 |
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| DOI: | 10.1109/ICEPT.2017.8046506 |