Integration of cooling devices in silicon technology

التفاصيل البيبلوغرافية
العنوان: Integration of cooling devices in silicon technology
المؤلفون: Perret, C., Boussey, J., Schaeffer, Ch., Coyaut, M.
المصدر: Conference Record of the 1999 IEEE Industry Applications Conference. Thirty-Forth IAS Annual Meeting (Cat. No.99CH36370) Industry applications Industry Applications Conference, 1999. Thirty-Fourth IAS Annual Meeting. Conference Record of the 1999 IEEE. 3:1780-1786 vol.3 1999
Relation: Proceedings of 34th Annual Meeting of the IEEE Industry Applications
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:078035589X
9780780355897
تدمد:01972618
DOI:10.1109/IAS.1999.805981