مؤتمر
Optimization of RF-22nm FDSOI figures of merit with 3D TCAD simulation
العنوان: | Optimization of RF-22nm FDSOI figures of merit with 3D TCAD simulation |
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المؤلفون: | Scheiblin, P., Lacord, J., Lucci, L., Barbe, J.C., Zaka, A., Bazizi, E. M., Herrmann, T., Morvan, S., Pirro, L., Andee, Y., Mazurier, J., Harame, D. |
المصدر: | 2017 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) Simulation of Semiconductor Processes and Devices (SISPAD), 2017 International Conference on. :369-372 Sep, 2017 |
Relation: | 2017 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9784863486119 9784863486126 9784863486102 |
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تدمد: | 19461569 19461577 |
DOI: | 10.23919/SISPAD.2017.8085341 |