مؤتمر
A novel low inductive 3D SiC power module based on hybrid packaging and integration method
| العنوان: | A novel low inductive 3D SiC power module based on hybrid packaging and integration method |
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| المؤلفون: | Huang, Zhizhao, Li, Yuxiong, Chen, Lichuan, Tan, Yifan, Chen, Cai, Kang, Yong, Luo, Fang |
| المصدر: | 2017 IEEE Energy Conversion Congress and Exposition (ECCE) Energy Conversion Congress and Exposition (ECCE), 2017 IEEE. :3995-4002 Oct, 2017 |
| Relation: | 2017 IEEE Energy Conversion Congress and Exposition (ECCE) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781509029983 9781509029976 |
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| DOI: | 10.1109/ECCE.2017.8096698 |