مؤتمر
Half-conductive coupling for chip-to-chip connections
| العنوان: | Half-conductive coupling for chip-to-chip connections |
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| المؤلفون: | Pan, W., De Tandt, C., Devisch, F., Vounckx, R., Kuijk, M. |
| المصدر: | IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) Electrical performance of electronic packaging Electrical Performance of Electronic Packaging, 1999. :29-32 1999 |
| Relation: | IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780355970 9780780355972 |
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| DOI: | 10.1109/EPEP.1999.819187 |