مؤتمر
Analytical model of internal heat transfer of a power chip with through silicon via
| العنوان: | Analytical model of internal heat transfer of a power chip with through silicon via |
|---|---|
| المؤلفون: | Liu, Jingyu, Wang, Yongyong, Yang, Xunyong, Yang, Fashun, Ma, Kui |
| المصدر: | 2017 IEEE 12th International Conference on ASIC (ASICON) ASIC (ASICON), 2017 IEEE 12th International Conference on. :588-591 Oct, 2017 |
| Relation: | 2017 IEEE 12th International Conference on ASIC (ASICON) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781509066230 9781509066254 |
|---|---|
| DOI: | 10.1109/ASICON.2017.8252544 |