مؤتمر
SPICE model for analyzing EMS responses of multilayer PCBs with nonlinear loads
| العنوان: | SPICE model for analyzing EMS responses of multilayer PCBs with nonlinear loads |
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| المؤلفون: | Li, Xuelian, Du, Zhengwei |
| المصدر: | 2017 IEEE 5th International Symposium on Electromagnetic Compatibility (EMC-Beijing) Electromagnetic Compatibility (EMC-Beijing), 2017 IEEE 5th International Symposium on. :1-4 Oct, 2017 |
| Relation: | 2017 IEEE 5th International Symposium on Electromagnetic Compatibility (EMC-Beijing) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781509051847 9781509051830 9781509051854 |
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| DOI: | 10.1109/EMC-B.2017.8260469 |