مؤتمر
SPICE model for analyzing EMS responses of multilayer PCBs with nonlinear loads
العنوان: | SPICE model for analyzing EMS responses of multilayer PCBs with nonlinear loads |
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المؤلفون: | Li, Xuelian, Du, Zhengwei |
المصدر: | 2017 IEEE 5th International Symposium on Electromagnetic Compatibility (EMC-Beijing) Electromagnetic Compatibility (EMC-Beijing), 2017 IEEE 5th International Symposium on. :1-4 Oct, 2017 |
Relation: | 2017 IEEE 5th International Symposium on Electromagnetic Compatibility (EMC-Beijing) |
قاعدة البيانات: | IEEE Xplore Digital Library |
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