مؤتمر
Material innovation for MOL, BEOL, and 3D integration
العنوان: | Material innovation for MOL, BEOL, and 3D integration |
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المؤلفون: | Koike, J., Hosseini, M., Hai, H. T., Ando, D., Sutou, Y. |
المصدر: | 2017 IEEE International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2017 IEEE International. :32.3.1-32.3.4 Dec, 2017 |
Relation: | 2017 IEEE International Electron Devices Meeting (IEDM) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9781538635599 9781538635582 |
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تدمد: | 2156017X |
DOI: | 10.1109/IEDM.2017.8268485 |