مؤتمر
Study on the touch risk of high density packaging bonding wire under mechanical shock condition
| العنوان: | Study on the touch risk of high density packaging bonding wire under mechanical shock condition |
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| المؤلفون: | Gu, Hantian, Zhu, Ming, Zhang, Wei, Zhu, Hengjing, Zhang, Lei |
| المصدر: | 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2017 IEEE. :1-4 Dec, 2017 |
| Relation: | 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781538612385 9781538612378 |
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| تدمد: | 21511233 |
| DOI: | 10.1109/EDAPS.2017.8277023 |