مؤتمر
Reliability prediction of LED packaging by fatigue behavior of bonding wire in power cycling accelerated test
| العنوان: | Reliability prediction of LED packaging by fatigue behavior of bonding wire in power cycling accelerated test |
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| المؤلفون: | Pan, Yongjun, Zhu, Fulong, Lin, Xinxin, Wang, Fengren, Shi, Lang, Kan, Yan, Liu, Sheng, Fan, Jiajie |
| المصدر: | 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2017 IEEE 19th. :1-4 Dec, 2017 |
| Relation: | 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781538630426 9781538630419 |
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| DOI: | 10.1109/EPTC.2017.8277431 |