مؤتمر
Thermo-mechanical design of fan-out wafer level package for power converter module
| العنوان: | Thermo-mechanical design of fan-out wafer level package for power converter module |
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| المؤلفون: | Chen, Z., Gongyue, T., Long, L.B., Zhi, D.M., Wai Leong Ching, E., Chong, C.T. |
| المصدر: | 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2017 IEEE 19th. :1-6 Dec, 2017 |
| Relation: | 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781538630426 9781538630419 |
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| DOI: | 10.1109/EPTC.2017.8277468 |