مؤتمر
Silica filler content in NCP and its effects on the reliability of 3D TSV Multi-Stack under thermal shock test
| العنوان: | Silica filler content in NCP and its effects on the reliability of 3D TSV Multi-Stack under thermal shock test |
|---|---|
| المؤلفون: | Alves Braganca, Wagno, Eom, Yong-Sung, Son, Jihye, Jang, Keon-Soo, Bae, Hyun-Cheol, Moon, Seok Hwan, Choi, Kwang-Seong |
| المصدر: | 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2017 IEEE 19th. :1-8 Dec, 2017 |
| Relation: | 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781538630426 9781538630419 |
|---|---|
| DOI: | 10.1109/EPTC.2017.8277495 |