مؤتمر
1μm Pitch direct hybrid bonding with
| العنوان: | 1μm Pitch direct hybrid bonding with |
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| المؤلفون: | Jouve, A., Balan, V., Bresson, N., Euvrard-Colnat, C., Fournel, F., Exbrayat, Y., Mauguen, G., Sater, M. Abdel, Beitia, C., Arnaud, L., Cheramy, S., Lhostis, S., Farcy, A., Guillaumet, S., Mermoz, S. |
| المصدر: | 2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2017 IEEE. :1-2 Oct, 2017 |
| Relation: | 2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781538637661 9781538637654 |
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| DOI: | 10.1109/S3S.2017.8309213 |