On the manifestation of Ge pre-amorphization implantation (PAI) impact on both the formation of ultrathin TiSix and the specific contact resistivity in TiSix/n-Si contacts for sub-16/14 nm nodes and beyond

التفاصيل البيبلوغرافية
العنوان: On the manifestation of Ge pre-amorphization implantation (PAI) impact on both the formation of ultrathin TiSix and the specific contact resistivity in TiSix/n-Si contacts for sub-16/14 nm nodes and beyond
المؤلفون: Luo, Jun, Mao, Shujuan, Xu, Jing, Wang, Guilei, Zhang, Dan, Luo, Xue, Duan, Ningyuan, Liu, Shi, Wang, Wenwu, Chen, Dapeng, Li, Junfeng, Zhao, Chao, Ye, Tianchun
المصدر: 2018 18th International Workshop on Junction Technology (IWJT) Junction Technology (IWJT), 2018 18th International Workshop on. :1-1 Mar, 2018
Relation: 2018 18th International Workshop on Junction Technology (IWJT)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9781538645116
9781538645130
9781538645123
DOI:10.1109/IWJT.2018.8330297