التفاصيل البيبلوغرافية
العنوان: |
Development of PEB face-down interconnection process for ultra thin flexible package |
المؤلفون: |
Lee, Jae Hak, Lee, Chung Woo, Kim, Yong Jin, Kim, Seung Man, Song, Jun-Yeob |
المصدر: |
2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition Microelectronics and Packaging Conference (EMPC) & Exhibition, 2017 21st European. :1-4 Sep, 2017 |
Relation: |
2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition |
قاعدة البيانات: |
IEEE Xplore Digital Library |