Development of PEB face-down interconnection process for ultra thin flexible package

التفاصيل البيبلوغرافية
العنوان:	Development of PEB face-down interconnection process for ultra thin flexible package
المؤلفون:	Lee, Jae Hak, Lee, Chung Woo, Kim, Yong Jin, Kim, Seung Man, Song, Jun-Yeob
المصدر:	2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition Microelectronics and Packaging Conference (EMPC) & Exhibition, 2017 21st European. :1-4 Sep, 2017
Relation:	2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition
قاعدة البيانات:	IEEE Xplore Digital Library

الوصف
ردمك:	9780956808646
DOI:	10.23919/EMPC.2017.8346830