التفاصيل البيبلوغرافية
العنوان: |
Newly developed high reliability palladium coated Cu wire for automotive application |
المؤلفون: |
Eto, Motoki, Haibara, Teruo, Oishi, Ryo, Yamada, Takashi, Uno, Tomohiro, Oyamada, Tetsuya |
المصدر: |
2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition Microelectronics and Packaging Conference (EMPC) & Exhibition, 2017 21st European. :1-5 Sep, 2017 |
Relation: |
2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition |
قاعدة البيانات: |
IEEE Xplore Digital Library |