التفاصيل البيبلوغرافية
| العنوان: |
Effect of metal line width on electromigration of BEOL Cu interconnects |
| المؤلفون: |
Choi, Seungman, Christiansen, Cathryn, Cao, Linjun, Zhang, James, Filippi, Ronald, Shen, Tian, Yeap, Kong Boon, Ogden, Sean, Zhang, Haojun, Fu, Bianzhu, Justison, Patrick |
| المصدر: |
2018 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2018 IEEE International. :4F.4-1-4F.4-6 Mar, 2018 |
| Relation: |
2018 IEEE International Reliability Physics Symposium (IRPS) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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