مؤتمر
STI scratch defects reduction by using solid pad in 1X technology node
| العنوان: | STI scratch defects reduction by using solid pad in 1X technology node |
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| المؤلفون: | Chen, Kuang-Wei, Chen, Yen-Ting, Chen, Chun-Fu, Luoh, Tuung, Yang, Lin-Wuu, Yang, Ta-Hone, Chen, Kuang-Chao, Tay, Yuchi, Chen, Yi Ming, Ton, Johnson, Lu, Yen Pin |
| المصدر: | 2018 China Semiconductor Technology International Conference (CSTIC) Semiconductor Technology International Conference (CSTIC), 2018 China. :1-3 Mar, 2018 |
| Relation: | 2018 China Semiconductor Technology International Conference (CSTIC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781538653081 9781538653074 |
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| DOI: | 10.1109/CSTIC.2018.8369263 |