التفاصيل البيبلوغرافية
| العنوان: |
Micro bump height derivation control with dynamic sizing patterning |
| المؤلفون: |
Liu, C. C., Chen, J. H., Hsu, Y. N., Tsai, M. H., Hung, C. C., Wang, R. D., Liu, C. S., Pan, T. H., Chen, C. S., Liu, K. C., Ku, Harry |
| المصدر: |
2018 29th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) SEMI Advanced Semiconductor Manufacturing Conference (ASMC), 2018 29th Annual. :103-105 Apr, 2018 |
| Relation: |
2018 29th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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