مؤتمر
Introduction of Sub-2-micron Cu traces to EnCoRe enhanced copper redistribution layers for heterogeneous chip integration
| العنوان: | Introduction of Sub-2-micron Cu traces to EnCoRe enhanced copper redistribution layers for heterogeneous chip integration |
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| المؤلفون: | Kudo, Hiroshi, Aritsuka, Yuuki, Masaya, Tanaka, Kasai, Ryohei, Suyama, Jyunichi, Takeda, Mitsuhiro, Okazaki, Yumi, Iida, Haruo, Kitayama, Daisuke, Sakamoto, Kouji, Takano, Takamasa, Akazawa, Miyuki, Sato, Hiroaki, Yamada, Shouhei, Kuramochi, Satoru |
| المصدر: | 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2018 International Conference on. :399-404 Apr, 2018 |
| Relation: | 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9784990218850 9784990218843 |
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| DOI: | 10.23919/ICEP.2018.8374332 |