مؤتمر
Investigation of the interfacial reactions and mechanical strength in the Sn-Ag-Cu (SAC)/Cu-Be alloy (Alloy 25) couple
| العنوان: | Investigation of the interfacial reactions and mechanical strength in the Sn-Ag-Cu (SAC)/Cu-Be alloy (Alloy 25) couple |
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| المؤلفون: | Chang, Jing-Shiun, Yen, Yee-Wen |
| المصدر: | 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2018 International Conference on. :97-101 Apr, 2018 |
| Relation: | 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9784990218850 9784990218843 |
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| DOI: | 10.23919/ICEP.2018.8374679 |