A new deep reactive ion etching process by dual sidewall protection layer

التفاصيل البيبلوغرافية
العنوان: A new deep reactive ion etching process by dual sidewall protection layer
المؤلفون: Ohara, J., Kano, K., Takeuchi, Y., Ohya, N., Otsuka, Y., Akita, S.
المصدر: Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308) Micro electro mechanical systems Micro Electro Mechanical Systems, 2000. MEMS 2000. The Thirteenth Annual International Conference on. :277-282 2000
Relation: Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:0780352734
9780780352735
تدمد:10846999
DOI:10.1109/MEMSYS.2000.838529