مؤتمر
Sequential 3D: Key integration challenges and opportunities for advanced semiconductor scaling
| العنوان: | Sequential 3D: Key integration challenges and opportunities for advanced semiconductor scaling |
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| المؤلفون: | Vandooren, A., Witters, L., Franco, J., Mallik, A., Parvais, B., Wu, Z., Walke, A., Deshpande, V., Rosseel, E., Hikavyy, A., Li, W., Peng, L., Rassoul, N., Jamieson, G., Inoue, F., Verbinnen, G., Devriendt, K., Teugels, L., Heylen, N., Vecchio, E., Zheng, T., Waldron, N., De Heyn, V., Mocuta, D., Collaert, N. |
| المصدر: | 2018 International Conference on IC Design & Technology (ICICDT) IC Design & Technology (ICICDT), 2018 International Conference on. :145-148 Jun, 2018 |
| Relation: | 2018 International Conference on IC Design & Technology (ICICDT) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781538625507 9781538625491 |
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| DOI: | 10.1109/ICICDT.2018.8399777 |