التفاصيل البيبلوغرافية
| العنوان: |
Thermo-mechanical Deformation in Flexible-Board Assemblies During Reflow and Post-Assembly Usage |
| المؤلفون: |
Lall, Pradeep, Goyal, Kartik, Leever, Ben, Marsh, Jason |
| المصدر: |
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2018 17th IEEE Intersociety Conference on. :26-31 May, 2018 |
| Relation: |
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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