التفاصيل البيبلوغرافية
| العنوان: |
Evaluation of Chip-Last Fan-Out Panel Level Packaging with G2.5 LCD Facility Using FlexUPTM and Mechanical De-bonding Technologies |
| المؤلفون: |
Cheng, Wei-Yuan, Yang, Chen-Tsai, Lin, Jie-Mo, Chen, Wei-Han, Wang, Tai-Jui, Lee, Yuh-Zheng |
| المصدر: |
2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2018 IEEE 68th. :386-391 May, 2018 |
| Relation: |
2018 IEEE 68th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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