The Effect of the SnAg Solder Joint Morphology on the Thermal Cycle Reliability of 40 µm Fine-Pitch Cu-Pillar/SnAg Micro Bump Interconnection

التفاصيل البيبلوغرافية
العنوان:	The Effect of the SnAg Solder Joint Morphology on the Thermal Cycle Reliability of 40 µm Fine-Pitch Cu-Pillar/SnAg Micro Bump Interconnection
المؤلفون:	Lee, SeYong, Lee, HanMin, Park, JongHo, Shin, SangMyung, Kim, WooJeong, Choi, TaeJin, Paik, Kyung-Wook
المصدر:	2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2018 IEEE 68th. :649-655 May, 2018
Relation:	2018 IEEE 68th Electronic Components and Technology Conference (ECTC)
قاعدة البيانات:	IEEE Xplore Digital Library