التفاصيل البيبلوغرافية
العنوان: |
The Effect of the SnAg Solder Joint Morphology on the Thermal Cycle Reliability of 40 µm Fine-Pitch Cu-Pillar/SnAg Micro Bump Interconnection |
المؤلفون: |
Lee, SeYong, Lee, HanMin, Park, JongHo, Shin, SangMyung, Kim, WooJeong, Choi, TaeJin, Paik, Kyung-Wook |
المصدر: |
2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2018 IEEE 68th. :649-655 May, 2018 |
Relation: |
2018 IEEE 68th Electronic Components and Technology Conference (ECTC) |
قاعدة البيانات: |
IEEE Xplore Digital Library |