التفاصيل البيبلوغرافية
| العنوان: |
Non-destructive Inspection of Flip-Chip BGA Solder Ball Defects Using Two Laser Beam Probe Ultrasonic Inspection Technique |
| المؤلفون: |
B. Reddy, Vishnu V., Ume, I. Charles, Mebane, Aaron, Imediegwu, Chidinma, Akinade, Kola, Chaudhuri, Amiya R., Rogers, Bryan, Hill, Mark, Guirguis, Cherif, Lee, Tae-Kyu |
| المصدر: |
2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2018 IEEE 68th. :764-770 May, 2018 |
| Relation: |
2018 IEEE 68th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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