Interconnection Process Using Laser and Hybrid Underfill for LED Array Module on PET Substrate

التفاصيل البيبلوغرافية
العنوان:	Interconnection Process Using Laser and Hybrid Underfill for LED Array Module on PET Substrate
المؤلفون:	Choi, Kwang-Seong, Braganca Junior, Wagno Alves, Jeong, leeseul, Jang, Keon-Soo, Moon, Seok Hwan, Bae, Hyun-Cheol, Eom, Yong-Sung, Cho, Min Kyo, Chang, Seung Il
المصدر:	2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2018 IEEE 68th. :1567-1573 May, 2018
Relation:	2018 IEEE 68th Electronic Components and Technology Conference (ECTC)
قاعدة البيانات:	IEEE Xplore Digital Library