مؤتمر
Reliability characterization of thermal micro-structures implemented on 0.8 /spl mu/m CMOS chips
| العنوان: | Reliability characterization of thermal micro-structures implemented on 0.8 /spl mu/m CMOS chips |
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| المؤلفون: | Sheng, L.Y., de Tandt, C., Ranson, W., Vounckx, R. |
| المصدر: | 2000 IEEE International Reliability Physics Symposium Proceedings. 38th Annual (Cat. No.00CH37059) Reliability physics Reliability Physics Symposium, 2000. Proceedings. 38th Annual 2000 IEEE International. :112-117 2000 |
| Relation: | 2000 IEEE International Reliability Physics Symposium Proceedings. 38th Annual |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780358600 9780780358607 |
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| DOI: | 10.1109/RELPHY.2000.843900 |