دورية أكاديمية
Skin Effect Suppressed Ni–Fe/Cu Electroplated Multilayer Wiring for High Data-Rate and Low Delay-Time I/O Interface Board
| العنوان: | Skin Effect Suppressed Ni–Fe/Cu Electroplated Multilayer Wiring for High Data-Rate and Low Delay-Time I/O Interface Board |
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| المؤلفون: | Yamaguchi, M., Yanai, T., Nakayama, H., Sai, R., Fujiwara, H., Kitai, Y., Sato, M., Sangawa, U. |
| المصدر: | IEEE Transactions on Magnetics IEEE Trans. Magn. Magnetics, IEEE Transactions on. 54(11):1-5 Nov, 2018 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 00189464 19410069 |
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| DOI: | 10.1109/TMAG.2018.2866126 |