مؤتمر
An effective way to solve the void problem of traditional underfill based on NCP technology
| العنوان: | An effective way to solve the void problem of traditional underfill based on NCP technology |
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| المؤلفون: | Liu, Guoheng, Xue, Jianrui, Gao, Liming, Li, Ming |
| المصدر: | 2018 19th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2018 19th International Conference on. :687-690 Aug, 2018 |
| Relation: | 2018 19th International Conference on Electronic Packaging Technology (ICEPT) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9781538663868 9781538663851 |
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| DOI: | 10.1109/ICEPT.2018.8480540 |