مؤتمر
Ultrasonic-assisted soldering of SAC0307 solder with Nano-particles active-flux
العنوان: | Ultrasonic-assisted soldering of SAC0307 solder with Nano-particles active-flux |
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المؤلفون: | Xia, Da-quan, Yang, Dong-hua, Liu, Xin, Zhou, Yu-feng, Gan, Gui-sheng, Wu, Yi-ping |
المصدر: | 2018 19th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2018 19th International Conference on. :1696-1701 Aug, 2018 |
Relation: | 2018 19th International Conference on Electronic Packaging Technology (ICEPT) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9781538663868 9781538663851 |
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DOI: | 10.1109/ICEPT.2018.8480589 |