دورية أكاديمية
Contact Resistance Model and Thermal Stability Analysis of Bolt Structure
| العنوان: | Contact Resistance Model and Thermal Stability Analysis of Bolt Structure |
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| المؤلفون: | Wu, Y., Ruan, J., Gong, Y., Long, M., Li, P. |
| المصدر: | IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 9(4):694-701 Apr, 2019 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 21563950 21563985 |
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| DOI: | 10.1109/TCPMT.2018.2877774 |