مؤتمر
The viability of anisotropic conductive film (ACF) as a flip chip interconnection technology
| العنوان: | The viability of anisotropic conductive film (ACF) as a flip chip interconnection technology |
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| المؤلفون: | Kim, K.M., Kim, J.O., Kim, S.G., Lee, K.H., Chen, A.S., Ahmad, N., Dugbartey, N., Karnezos, M., Tam, S., Kweon, Y.D., Pendse, R. |
| المصدر: | 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) Electronic components and technology Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th. :1122-1132 2000 |
| Relation: | 2000 Proceedings. 50th Electronic Components and Technology Conference |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780359089 9780780359086 |
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| DOI: | 10.1109/ECTC.2000.853312 |