مؤتمر
Temperature Impact on Surface Roughness Modeling for On-Package High Speed Interconnects
العنوان: | Temperature Impact on Surface Roughness Modeling for On-Package High Speed Interconnects |
---|---|
المؤلفون: | Geyik, Cemil S., Zhang, Zhichao, Christ, Sean R., Wojewoda, Leigh E., Aygun, Kemal |
المصدر: | 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Electrical Performance of Electronic Packaging and Systems (EPEPS), 2018 IEEE 27th Conference on. :271-273 Oct, 2018 |
Relation: | 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9781538693032 9781538651667 |
---|---|
تدمد: | 21654115 |
DOI: | 10.1109/EPEPS.2018.8534203 |