مؤتمر
Temperature Impact on Surface Roughness Modeling for On-Package High Speed Interconnects
| العنوان: | Temperature Impact on Surface Roughness Modeling for On-Package High Speed Interconnects |
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| المؤلفون: | Geyik, Cemil S., Zhang, Zhichao, Christ, Sean R., Wojewoda, Leigh E., Aygun, Kemal |
| المصدر: | 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Electrical Performance of Electronic Packaging and Systems (EPEPS), 2018 IEEE 27th Conference on. :271-273 Oct, 2018 |
| Relation: | 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781538693032 9781538651667 |
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| تدمد: | 21654115 |
| DOI: | 10.1109/EPEPS.2018.8534203 |