مؤتمر
A reliability and failure mode analysis of no flow underfill materials for low cost flip chip assembly
| العنوان: | A reliability and failure mode analysis of no flow underfill materials for low cost flip chip assembly |
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| المؤلفون: | Smith, B.S., Thorpe, R., Baldwin, D.F. |
| المصدر: | 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) Electronic components and technology Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th. :1719-1730 2000 |
| Relation: | 2000 Proceedings. 50th Electronic Components and Technology Conference |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780359089 9780780359086 |
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| DOI: | 10.1109/ECTC.2000.853452 |