مؤتمر
New strategy to improve the mechanical strength and to reduce potential contamination of dielectric materials for double level metal integration
| العنوان: | New strategy to improve the mechanical strength and to reduce potential contamination of dielectric materials for double level metal integration |
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| المؤلفون: | Assous, M., Morand, Y., Demolliens, O., Berruyer, P., Manierre, B., Gobil, Y., Louis, D., Feldis, H., Vizioz, C., Roman, A. |
| المصدر: | Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) Interconnect technology Interconnect Technology Conference, 2000. Proceedings of the IEEE 2000 International. :90-92 2000 |
| Relation: | Proceedings of the IEEE 2000 International Interconnect Technology Conference |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780363272 9780780363274 |
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| DOI: | 10.1109/IITC.2000.854291 |