Half-conductive coupling interconnection technology for digital transmission between CMOS chips

التفاصيل البيبلوغرافية
العنوان: Half-conductive coupling interconnection technology for digital transmission between CMOS chips
المؤلفون: Pan, W., Devisch, F., De Tandt, C., Vounckx, R., Kuijk, M.
المصدر: Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) Interconnect technology Interconnect Technology Conference, 2000. Proceedings of the IEEE 2000 International. :228-230 2000
Relation: Proceedings of the IEEE 2000 International Interconnect Technology Conference
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:0780363272
9780780363274
DOI:10.1109/IITC.2000.854333