مؤتمر
A high performance 0.13 /spl mu/m copper BEOL technology with low-k dielectric
العنوان: | A high performance 0.13 /spl mu/m copper BEOL technology with low-k dielectric |
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المؤلفون: | Goldblatt, R.D., Agarwala, B., Anand, M.B., Barth, E.P., Biery, G.A., Chen, Z.G., Cohen, S., Connolly, J.B., Cowley, A., Dalton, T., Das, S.K., Davis, C.R., Deutsch, A., DeWan, C., Edelstein, D.C., Emmi, P.A., Faltermeier, C.G., Fitzsimmons, J.A., Hedrick, J., Heidenreich, J.E., Hu, C.K., Hummel, J.P., Jones, P., Kaltalioglu, E., Kastenmeier, B.E., Krishnan, M., Landers, W.F., Liniger, E., Liu, J., Lustig, N.E., Malhotra, S., Manger, D.K., McGahay, V., Mih, R., Nye, H.A., Purushothaman, S., Rathore, H.A., Seo, S.C., Shaw, T.M., Simon, A.H., Spooner, T.A., Stetter, M., Wachnik, R.A., Ryan, J.G. |
المصدر: | Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) Interconnect technology Interconnect Technology Conference, 2000. Proceedings of the IEEE 2000 International. :261-263 2000 |
Relation: | Proceedings of the IEEE 2000 International Interconnect Technology Conference |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 0780363272 9780780363274 |
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DOI: | 10.1109/IITC.2000.854342 |