مؤتمر
Development of PEB Face-Down Interconnect Process for Wearable Device
العنوان: | Development of PEB Face-Down Interconnect Process for Wearable Device |
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المؤلفون: | Lee, Jae Hak, Lee, Chung Woo, Kim, Yong Jin, Kim, Seung Man, Song, Jun-Yeob |
المصدر: | 2018 7th Electronic System-Integration Technology Conference (ESTC) Electronic System-Integration Technology Conference (ESTC), 2018 7th. :1-4 Sep, 2018 |
Relation: | 2018 7th Electronic System-Integration Technology Conference (ESTC) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9781538668146 9781538668139 |
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DOI: | 10.1109/ESTC.2018.8546418 |