مؤتمر
Chip-package-board reliability of System-in-Package using laminate chip embedding technology based on Cu leadframe
| العنوان: | Chip-package-board reliability of System-in-Package using laminate chip embedding technology based on Cu leadframe |
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| المؤلفون: | Fruehauf, Peter, Munding, Andreas, Pressel, Klaus, Vogt, Michael, Schwarz, Patrick |
| المصدر: | 2018 7th Electronic System-Integration Technology Conference (ESTC) Electronic System-Integration Technology Conference (ESTC), 2018 7th. :1-7 Sep, 2018 |
| Relation: | 2018 7th Electronic System-Integration Technology Conference (ESTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9781538668146 9781538668139 |
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| DOI: | 10.1109/ESTC.2018.8546426 |