التفاصيل البيبلوغرافية
| العنوان: |
Structural analysis and modelling of packaged light emitting devices by thermal transient measurements at multiple boundaries |
| المؤلفون: |
Farkas, G., Poppe, A., Gaal, L., Hantos, G., Berenyi, Cs., Rencz, M. |
| المصدر: |
2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Thermal Investigations of ICs and Systems (THERMINIC), 2018 24rd International Workshop on. :1-7 Sep, 2018 |
| Relation: |
2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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