دورية أكاديمية
Thermal Analysis Approach for Predicting Power Device Lifetime
العنوان: | Thermal Analysis Approach for Predicting Power Device Lifetime |
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المؤلفون: | Russo, S., Bazzano, G., Cavallaro, D., Sitta, A., Calabretta, M. |
المصدر: | IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 19(1):159-163 Mar, 2019 |
قاعدة البيانات: | IEEE Xplore Digital Library |
تدمد: | 15304388 15582574 |
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DOI: | 10.1109/TDMR.2019.2892185 |