مؤتمر
Key challenges and opportunities for 3D sequential integration
| العنوان: | Key challenges and opportunities for 3D sequential integration |
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| المؤلفون: | Vandooren, A., Witters, L., Franco, J., Mallik, A., Parvais, B., Wu, Z., Li, W., Rosseel, E., Hikkavyy, A., Peng, L., Rassoul, N., Jamieson, G., Inoue, F., Verbinnen, G., Devriendt, K., Teugels, L., Heylen, N., Vecchio, E., Zheng, T., Waldron, N., Boemmels, J., De Heyn, V., Mocuta, D., Ryckaert, J., Collaert, N. |
| المصدر: | 2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2018 IEEE. :1-4 Oct, 2018 |
| Relation: | 2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9781538676271 9781538676264 |
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| DOI: | 10.1109/S3S.2018.8640203 |